Taipei - In an effort to expand international academic networks and enhance the quality of education and research, Institut Teknologi Kalimantan (ITK) continues to actively establish collaborations with global institutions. One of these strategic initiatives was carried out by ITK lecturer, Andromeda Dwi Laksono, S.T., M.Sc., Ph.D., through a series of guest lectures and the initiation of international cooperation in Taiwan from August 11–15, 2025.

This activity aimed to disseminate knowledge, promote ITK on the international stage, and open opportunities for research collaboration and academic mobility with overseas universities. Throughout the program, Andromeda Dwi Laksono delivered various materials in the field of materials science relevant to current technological developments.

The guest lecture series began at the Department of Materials Science and Engineering, National Taiwan University of Science and Technology (NTUST), Taipei. Over four days, the lectures covered a range of topics from fundamental to applied concepts, including Atomic Structure & Bonding, Crystal Structures & Defects, Mechanical & Physical Properties, and Binary Phase Diagrams. The sessions were conducted interactively, involving students from diverse academic levels and backgrounds, fostering dynamic and productive academic discussions.

In the following sessions, the materials became more advanced, focusing on heat treatment processes such as annealing, quenching, and tempering, along with their effects on material properties. The highlight of the NTUST lectures included discussions on lead vs. lead-free solders, solder microstructure, and joint reliability testing. Students were also actively engaged through group discussions and presentations on contemporary issues in materials science, reflecting their high level of participation and enthusiasm.

In addition to NTUST, guest lectures were also conducted at the National Taipei University of Technology (NTUT) and National Chung Hsing University (NCHU). At NTUT, Andromeda presented a research topic titled “Breaking Barriers: Engineering Be-Alloyed Cu Interfaces for Next-Gen Lead-Free Solder”, followed by a laboratory tour and interactive discussions with undergraduate and graduate students. Meanwhile, at NCHU, the presentation titled “Disrupting the Interface: How Titanium Alters Solder Joint Behavior in Lead-Free Sn-Based Systems” further opened opportunities for academic dialogue and potential collaborative research.

Beyond academic engagement, the visit also resulted in a significant step toward strengthening international cooperation through the initiation of a Memorandum of Understanding (MoU) between ITK and NTUST. The meeting, attended by representatives from both institutions, discussed potential collaborations in education, research, and student mobility programs. One notable opportunity offered by NTUST was a one-year post-bachelor program for Indonesian students.

As a follow-up, it was agreed that a formal institutional framework was necessary to support collaboration at the departmental level. This led to the development of a Memorandum of Agreement (MoA), involving relevant stakeholders within ITK. Ultimately, in January 2026, the MoA document was officially signed by both parties, marking a concrete commitment to sustained academic collaboration.

This initiative demonstrates ITK’s strong commitment to advancing education and research through global partnerships. It is expected that this collaboration will create broader opportunities for ITK lecturers and students to engage in international academic activities, while also fostering innovation and impactful research for the wider community.